Enhance e-motor performance with advanced winding technologies. We seek innovations in Litz wire, additive manufacturing, and material combinations. Solutions include but are not limited to superior insulation systems using enamels or insulation foils. Your solutions improve e-motor reliability and efficiency in high-performance applications as well as advance the state of the art in electric powertrain technology.

Purpose:

Enhance the performance and reliability of e-motors in high-performance.

Technology Carrier

• Winding technology: Litzwire, additive manufacturing (copper & insulation system), Material combination (copper/aluminium)
• Insulation system: enamel, insulation foils, etc.

Technology Requirements:

• Forming process to be applied as distributed, wave-winding, and tooth coil winding
• Reduction of insulation thickness (process or new material - requirement Electric insulation system class for traction motors)
• Compatibility for oiled systems
• Cost reduction compared to existing system or power density improvements
• Aluminium or copper material welding, lasering, additive printing (combination of both materials wished)

Ensure optimal performance of racing fuel cell systems through advanced cooling solutions. We need technologies that maintain effective cooling under extreme conditions. We are on the search for systems that optimize performance, extend system life, and enhance reliability. Your innovations will be critical for the next generation of high-performance fuel cell vehicles.

Purpose:

Ensure effective cooling of fuel cell systems under extreme operating conditions and optimize performance, extend system life, and enhance operational reliability.

Requirements:

• Cooling Performance: fuel cell temperature at least 10°C to 15°C below the maximum operating values
• Response Time: react within reasonable time to maintain optimal operating temperature
• Weight Efficiency: minimal weight and packaging space to meet the requirements
• Components outside the stack and intelligent controls are targeted.

Improve power module efficiency with immersion cooling technology. We seek solutions that enhance thermal performance and extend lifespan while reducing weight. Your solution could utilize advanced semiconductor materials like Silicon Carbide or Gallium Nitride, but we are also open to other solutions that fit our challenge. We are looking for systems that revolutionize power electronics cooling. Help us create lighter, more efficient, and longer-lasting power modules.

Purpose:

Improve thermal efficiency and lifespan of the components while minimizing the overall weight of the system.

Technology Carrier:

• Semiconductor Materials: Silicon Carbide or Gallium Nitride

Technology Requirements:

• immersed embedding of power modules with nonconductive cooling fluids
• bonding, carrier, and insulation technology
• integration and housing system